Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

by Yong Liu and Shichun Qu

Book Overview

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly,...

• Format: Hardcover
• Language: English
• ISBN: 149391555X
• ISBN13: 9781493915552
• Release Date: September 2014
• Publisher: Springer
• Length: 322 Pages
• Weight: 1.44 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"