Wafer Level 3-D ICS Process Technology

by Chuan Seng Tan

Book Overview

Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental...

• Format: Paperback
• Language: English
• ISBN: 1441945628
• ISBN13: 9781441945624
• Release Date: December 2010
• Publisher: Springer
• Length: 410 Pages
• Weight: 1.16 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"