Vibration Analysis for Electronic Equipment

by Dave S. Steinberg

Book Overview

A practical guide to quick methods for designing electronic equipment that must withstand severe vibration & shock--and the only book that shows how to predict the operational life of electronic equipment, based on the component type & type of vibration & shock exposure. This 2nd Edition presents new material, never published before, on predicting fatigue life in sinusoidal vibration, random vibration & acoustic noise, & pyrotechnic shock. Each new...

• Format: Hardcover
• Language: English
• ISBN: 0471821004
• ISBN13: 9780471821007
• Release Date: January 1973
• Publisher: John Wiley & Sons
• Length: 467 Pages
• Weight: 1.70 lbs.

Customer Reviews

Application beyond just electronics

The author is obviously an engineer who understands the everyday practical problems a dynamicist faces. Some theory, but chock full of easy to understand, and more importantly, *useful* information necessary to put properly designed product out the door.Don't let the title fool you. The focus of this book is electronics, but the material here is applicable to any vibration problem.If you're doing any dynamics work, you NEED this book.

A tool for success

If a mechanical engineer has chosen a career in the world of electronics, I strongly recommend this easy to follow gold mine of a book. I say it is a gold mine because it applies directly to the engineers' job. There are no fluff chapters or topics. Everything applies. Steinberg has made it easy (and almost fun) to solve those every day shock, vibration and acoustic challenges. Finding the natural frequency of a body such as a PC board is so much simpler for me now. And a surprising tidbit was for me to discover some amazing facts concerning acoustics. This is especially important as applied to fan cooled electronic packages. Another important area of study was packaging for transportation. How many times have we simply said "Just pack it in foam"? Before reading this book, I couldn't be sure what foam density to use or what the optimum thickness was. Why guess? Do it right.I borrowed this book from my employer, took it home and read it over the long Christmas weekend. I was so impressed, that I am purchasing my personal copy tonight. I won't be without it.

This Book is to the point, get it done, structural dynamics.

This reference is a must read for any structural engineer entering into the the electronic packaging world. You can't go wrong with the easy to understand examples and extra insight the book gives to the rapid engineering production world we live in today. Michael Rogers - Structural Engineer