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Tsv 3D RF Integration: High Resistivity Si Interposer Technology
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Tsv 3D RF Integration: High Resistivity Si Inte... 0323996027 Book Cover

Tsv 3D RF Integration: High Resistivity Si Inte...

by and
Edition Description

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level...

Edition Details
Format:Paperback
Language:English
ISBN:0323996027
Format: Paperback
Condition:
$
281.57
50 Available
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