Tribology In Chemical-Mechanical Planarization

by David Craven and Hong Liang

Book Overview

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other...

• Format: Paperback
• Language: English
• ISBN: 0367393255
• ISBN13: 9780367393250
• Release Date: September 2019
• Publisher: CRC Press
• Length: 200 Pages
• Weight: 0.40 lbs.
• Dimensions: 0.5" x 6.1" x 9.1"