Three Dimensional System Integration: IC Stacking Process and Design

by Riko Radojcic and Antonis Papanikolaou

Book Overview

The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach.

• Format: Hardcover
• Language: English
• ISBN: 1441909613
• ISBN13: 9781441909619
• Release Date: December 2010
• Publisher: Springer
• Length: 246 Pages
• Weight: 1.26 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"