Temperature-Aware Design and Management for 3D Multi-Core Architectures

by Mohamed M. Sabry and David Atienza

Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 1601987749
• ISBN13: 9781601987747
• Release Date: January 2014
• Publisher: Now Publishers
• Length: 96 Pages
• Weight: 0.32 lbs.
• Dimensions: 0.2" x 6.1" x 9.2"