System-In-Package: Electrical and Layout Perspectives

by Lei He, Shauki Elassaad, Yiyu Shi, et al.

With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components...

• Format: Paperback
• Language: English
• ISBN: 1601984588
• ISBN13: 9781601984586
• Release Date: June 2011
• Publisher: Now Publishers
• Length: 94 Pages
• Weight: 0.32 lbs.
• Dimensions: 0.2" x 6.1" x 9.2"