Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias

by Riko Radojcic

Scientist and engineers as well as graduate students in the fields of This conference will be of interest to anyone involved in Physics, Electrical Engineering, Materials Science and Engineering, Reliability and Quality Management, both in industry and academia. One current challenge to micro- and nanoelectronics is the understanding of stress-related phenomena in 3D IC integration. Stresses arising in 3D TSV interconnects and in the surrounding materials...

• Format: Paperback
• Language: English
• ISBN: 0735409382
• ISBN13: 9780735409385
• Release Date: November 2011
• Publisher: American Institute of Physics
• Length: 175 Pages
• Weight: 0.73 lbs.
• Dimensions: 0.6" x 6.6" x 9.6"