Solder Joint Technology: Materials, Properties, and Reliability

by King-Ning Tu

The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods...

• Format: Paperback
• Language: English
• ISBN: 1441922849
• ISBN13: 9781441922847
• Release Date: November 2010
• Publisher: Springer
• Length: 370 Pages
• Weight: 1.19 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"