Solder Joint Technology: Materials, Properties, and Reliability

by King-Ning Tu

Book Overview

The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods...

• Format: Hardcover
• Language: English
• ISBN: 0387388907
• ISBN13: 9780387388908
• Release Date: August 2007
• Publisher: Springer
• Length: 370 Pages
• Weight: 1.46 lbs.
• Dimensions: 0.9" x 6.5" x 9.2"