Solder Joint Reliability Prediction for Multiple Environments

by Andrew E. Perkins, Suresh K. Sitaraman, Suresh K Sitaraman

Book Overview

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations...

• Format: Paperback
• Language: English
• ISBN: 1441946349
• ISBN13: 9781441946348
• Release Date: November 2010
• Publisher: Springer
• Length: 192 Pages
• Weight: 0.66 lbs.
• Dimensions: 0.4" x 6.1" x 9.2"