Routing in the Third Dimension: From VLSI Chips to McMs

by Siddharth Bhingarde, Naveed A. Sherwani, Anand Panyam

This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.

• Format: Hardcover
• Language: English
• ISBN: 0780310896
• ISBN13: 9780780310896
• Release Date: March 1995
• Publisher: Wiley-IEEE Press
• Length: 376 Pages
• Weight: 2.90 lbs.
• Dimensions: 1.0" x 6.4" x 9.3"