RF Measurements of Die and Packages

By Scott, A. Wartenberg and Scott A. Wartenberg

This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 158053273X
• ISBN13: 9781580532730
• Release Date: May 2002
• Publisher: Artech House Publishers
• Length: 244 Pages
• Weight: 1.15 lbs.
• Dimensions: 0.8" x 6.4" x 9.3"