Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science

by George Harman

Book Overview

Hardcover Book - Wire Bonding in Microelectronics ISBN # 0-930815-25-4 This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0930815254
• ISBN13: 9780930815257
• Release Date: January 1989
• Publisher: International Society for Hybrid Microelectro
• Length: 202 Pages
• Weight: 0.66 lbs.