Reflow Soldering: Apparatus and Heat Transfer Processes

by Habil Illes Balazs, Oliver Krammer, Attila Geczy, et al.

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure...

• Format: Paperback
• Language: English
• ISBN: 0128185058
• ISBN13: 9780128185056
• Release Date: July 2020
• Publisher: Elsevier
• Length: 294 Pages
• Weight: 0.87 lbs.
• Dimensions: 0.6" x 6.0" x 9.0"