Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

by Yong Liu

Book Overview

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic...

• Format: Paperback
• Language: English
• ISBN: 1489987975
• ISBN13: 9781489987976
• Release Date: April 2014
• Publisher: Springer
• Length: 594 Pages
• Weight: 1.86 lbs.
• Dimensions: 1.2" x 6.1" x 9.2"