Physical Design for Multichip Modules

by Mysore Sriram, Sung-Mo Kang, Sung-Mo (Steve) Kang

Book Overview

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers...

• Format: Paperback
• Language: English
• ISBN: 1461361532
• ISBN13: 9781461361534
• Release Date: October 2012
• Publisher: Springer
• Length: 197 Pages
• Weight: 0.68 lbs.
• Dimensions: 0.5" x 6.1" x 9.2"