Packaging of High Power Semiconductor Lasers

by Xingsheng Liu, Wei Zhao, Lingling Xiong, et al.

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1461492629
• ISBN13: 9781461492627
• Release Date: July 2014
• Publisher: Springer
• Length: 402 Pages
• Weight: 1.68 lbs.
• Dimensions: 0.9" x 6.1" x 9.2"