Modeling and Simulation for Pa

by Sheng Liu and Yong Liu

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0470827807
• ISBN13: 9780470827802
• Release Date: May 2011
• Publisher: Wiley
• Length: 576 Pages
• Weight: 2.50 lbs.
• Dimensions: 1.3" x 6.9" x 9.8"