Mems Packaging

by Y C Lee

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS...

• Format: Hardcover
• Language: English
• ISBN: 9813229357
• ISBN13: 9789813229358
• Release Date: February 2018
• Publisher: World Scientific Publishing Company
• Length: 364 Pages
• Weight: 1.44 lbs.
• Dimensions: 0.8" x 6.0" x 9.0"