Materials for Advanced Packaging

by C.P. Wong

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such...

• Format: Hardcover
• Language: English
• ISBN: 0387782184
• ISBN13: 9780387782188
• Release Date: December 2008
• Publisher: Springer
• Length: 724 Pages
• Weight: 3.00 lbs.
• Dimensions: 1.7" x 6.5" x 9.8"