Integrated System-Level Modeling of Network-On-Chip Enabled Multi-Processor Platforms

by Tim Kogel, Heinrich Meyr, Rainer Leupers

Book Overview

Foreword. Preface.

1. INTRODUCTION. 1.1 Organization of the Book Chapters.

2. EMBEDDED SOC APPLICATIONS. 2.1 Networking Domain. 2.2 Multimedia Domain. 2.3 Wireless Communications. 2.4 Application Trends. 2.5 First Order Application Partitioning.

3. CLASSIFICATION OF PLATFORM ELEMENTS. 3.1 Architecture Metrics. 3.2 Processing Elements. 3.3 On-Chip Communication. 3.4 Summary.

4. SYSTEM LEVEL DESIGN PRINCIPLES. 4.1 The...

• Format: Paperback
• Language: English
• ISBN: 9048172020
• ISBN13: 9789048172023
• Release Date: November 2010
• Publisher: Springer
• Length: 186 Pages
• Weight: 0.68 lbs.
• Dimensions: 0.5" x 6.1" x 9.2"