Integrated Circuit Packaging, Assembly and Interconnections

by William J. Greig

Book Overview

Reviewing various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing...

• Format: Paperback
• Language: English
• ISBN: 1441939237
• ISBN13: 9781441939234
• Release Date: October 2010
• Publisher: Springer
• Length: 300 Pages
• Weight: 1.01 lbs.
• Dimensions: 0.7" x 6.1" x 9.2"