Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

by Michael G. Pecht

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:
* Define...

• Format: Hardcover
• Language: English
• ISBN: 0471594466
• ISBN13: 9780471594468
• Release Date: March 1994
• Publisher: Wiley-Interscience
• Length: 464 Pages
• Weight: 1.75 lbs.
• Dimensions: 1.1" x 6.5" x 9.6"