High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds

By Xiaoning Qi

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• Format: Paperback
• Language: English
• ISBN: 3639130952
• ISBN13: 9783639130959
• Release Date: March 2009
• Publisher: VDM Verlag
• Length: 132 Pages
• Weight: 0.45 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"