Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

by Hongtao Ma, Tae-Kyu Lee, Choong-Un Kim, et al.

Book Overview

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

• Format: Hardcover
• Language: English
• ISBN: 1461492653
• ISBN13: 9781461492658
• Release Date: November 2014
• Publisher: Springer
• Length: 253 Pages
• Weight: 1.22 lbs.
• Dimensions: 0.6" x 6.1" x 9.2"