Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys(r)

by István Maros and İbrahim Güven

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS? describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS? that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples...

• Format: Hardcover
• Language: English
• ISBN: 1402073305
• ISBN13: 9781402073304
• Release Date: December 2002
• Publisher: Springer
• Length: 185 Pages
• Weight: 1.10 lbs.
• Dimensions: 0.7" x 6.4" x 9.5"