Encapsulation Technologies for Electronic Applications

by Jiawei Zhang, Haleh Ardebili, Michael Pecht

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization...

• Format: Paperback
• Language: English
• ISBN: 0128119780
• ISBN13: 9780128119785
• Release Date: October 2018
• Publisher: William Andrew
• Length: 508 Pages
• Weight: 1.49 lbs.
• Dimensions: 1.0" x 6.0" x 9.0"