Elements of Electromigration: Electromigration in 3D IC technology

by King-Ning Tu and Yingxia Liu

In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.

In the era of big data and artificial intelligence, next-generation microelectronic devices for consumers must be smaller, consume less power, cost less, and,...

• Format: Hardcover
• Language: English
• ISBN: 1032470275
• ISBN13: 9781032470276
• Release Date: January 2024
• Publisher: CRC Press
• Length: 132 Pages
• Weight: 0.95 lbs.
• Dimensions: 0.4" x 6.7" x 9.6"