Electronic Packaging: Design, Materials, Process, and Reliability

by John H. Lau and C.P. Wong

Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed,... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0070371350
• ISBN13: 9780070371354
• Release Date: February 1998
• Publisher: McGraw-Hill Professional Publishing
• Length: 498 Pages
• Weight: 1.95 lbs.
• Dimensions: 1.6" x 6.3" x 9.3"