Electromigration in Metals: Fundamentals to Nano-Interconnects

by Martin Gall, Paul Ho, Chao-Kun Hu

Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies,... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1107032385
• ISBN13: 9781107032385
• Release Date: September 2022
• Publisher: Cambridge University Press
• Length: 430 Pages
• Weight: 2.10 lbs.
• Dimensions: 0.8" x 6.9" x 9.9"