Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by Er-Ping Li

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems

Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and...

• Format: Hardcover
• Language: English
• ISBN: 0470623462
• ISBN13: 9780470623466
• Release Date: April 2012
• Publisher: Wiley-IEEE Press
• Length: 384 Pages
• Weight: 1.67 lbs.
• Dimensions: 1.2" x 6.1" x 9.4"