Copper Wire Bonding

by Michael G. Pecht, Zhaowei Zhong, Preeti Chauhan, et al.

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to...

• Format: Hardcover
• Language: English
• ISBN: 1461457602
• ISBN13: 9781461457602
• Release Date: September 2013
• Publisher: Springer
• Length: 235 Pages
• Weight: 0.95 lbs.
• Dimensions: 0.8" x 6.3" x 9.2"