Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect

by Sunjung Kim

No Synopsis Available.

• Format: Paperback
• Language: English
• ISBN: 3639111303
• ISBN13: 9783639111309
• Release Date: December 2008
• Publisher: VDM Verlag
• Length: 144 Pages
• Weight: 0.44 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"