Chip Scale Package: Design, Materials, Process, Reliability, and Applications

by Ricky S.W. Lee, John H. Lau, S.W. Ricky Lee

This text details current trends in CSP (Chip Scale Packaging) design and developments, covering each major type, chip scale and package developed by each major vendor, detailing the efficiency and... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0070383049
• ISBN13: 9780070383043
• Release Date: February 1999
• Publisher: McGraw-Hill Professional Publishing
• Length: 564 Pages
• Weight: 2.42 lbs.
• Dimensions: 1.8" x 6.3" x 9.3"