Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnec

by Christopher Lyle Borst, Ronald J. Gutmann, William N Gill, et al.

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 1461354242
• ISBN13: 9781461354246
• Release Date: February 2014
• Publisher: Springer
• Length: 229 Pages
• Weight: 0.78 lbs.
• Dimensions: 0.5" x 6.1" x 9.2"