Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

by L.J. Ernst and O. de Saint Leger

Book Overview

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 1441948732
• ISBN13: 9781441948731
• Release Date: December 2010
• Publisher: Springer
• Length: 192 Pages
• Weight: 0.66 lbs.
• Dimensions: 0.4" x 6.1" x 9.2"