Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

by Ephraim Suhir

Book Overview

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

• Format: Paperback
• Language: English
• ISBN: 0367635887
• ISBN13: 9780367635886
• Release Date: October 2024
• Publisher: CRC Press
• Length: 382 Pages
• Weight: 1.25 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"