Advances in Cmp Polishing Technologies

by Ioan D. Marinescu and Syuhei Kurokawa

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1437778593
• ISBN13: 9781437778595
• Release Date: December 2011
• Publisher: William Andrew
• Length: 328 Pages
• Weight: 1.20 lbs.
• Dimensions: 1.0" x 6.1" x 9.1"