Advances in Chemical Mechanical Planarization (Cmp)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP.

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• Format: Paperback
• Language: English
• ISBN: 012821791X
• ISBN13: 9780128217917
• Release Date: September 2021
• Publisher: Woodhead Publishing
• Length: 648 Pages
• Weight: 1.89 lbs.
• Dimensions: 1.3" x 6.0" x 9.0"