Advances in 3D Integrated Circuits and Systems

by Hao Yu, Chuan Seng Tan, Chuan-Seng Tan

Book Overview

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management;...

• Format: Paperback
• Language: English
• ISBN: 9814699012
• ISBN13: 9789814699013
• Release Date: August 2015
• Publisher: World Scientific Publishing Company
• Length: 392 Pages
• Weight: 1.25 lbs.
• Dimensions: 0.9" x 6.0" x 8.9"