Advanced Liquid Metal Cooling for Chip, Device and System

by Jing Liu

This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category -- liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both...

• Format: Hardcover
• Language: English
• ISBN: 9811245851
• ISBN13: 9789811245855
• Release Date: May 2022
• Publisher: World Scientific Publishing Company
• Length: 960 Pages
• Weight: 3.18 lbs.
• Dimensions: 2.0" x 6.0" x 9.0"