3D Microelectronic Packaging: From Architectures to Applications

by Yan Li

Book Overview

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced...

• Format: Hardcover
• Language: English
• ISBN: 9811570892
• ISBN13: 9789811570896
• Release Date: November 2020
• Publisher: Springer
• Length: 622 Pages
• Weight: 2.35 lbs.
• Dimensions: 1.4" x 6.1" x 9.2"