3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility

by Lih-Tyng Hwang and Tzyy-Sheng Jason Horng

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab Fundamental design topics such as electromagnetic design...

• Format: Hardcover
• Language: English
• ISBN: 1119289645
• ISBN13: 9781119289647
• Release Date: July 2018
• Publisher: Wiley-IEEE Press
• Length: 464 Pages