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Principles and Methods for Assessing Autoimmunity Associated with Ex...
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Principles and Methods for Assessing Autoimmunity Associated with Exposure to Chemicals
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48.82
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Format: Paperback
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Transgenic Mutagenicity Assays (Environmental Health Criteria Series...
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Transgenic Mutagenicity Assays (Environmental Health Criteria Series) (Environmental Health Criteria Series)
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26.29
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Dermal Absorption (Environmental Health Criteria Series)
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Dermal Absorption (Environmental Health Criteria Series)
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39.59
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IPC-J-STD-001HS-CN Space and Military Applications Electronic Hardwa...
IPC-J-STD-001HS-CN Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
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IPC-2222B Sectional Design Standard for Rigid Organic Printed Boards...
IPC-2222B Sectional Design Standard for Rigid Organic Printed Boards
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IPC J-STD-001H-KR Requirements for Soldered Electrical and Electroni...
IPC J-STD-001H-KR Requirements for Soldered Electrical and Electronic Assemblies (Korean)
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IPC-7093A Design and Assembly Process Implementation for Bottom Term...
IPC-7093A Design and Assembly Process Implementation for Bottom Termination (BTC) Components
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IPC-2231 DFX Guidelines (Chinese)
IPC-2231 DFX Guidelines (Chinese)
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IPC-2591-V1-2 Connected Factory Exchange (CFX)
IPC-2591-V1-2 Connected Factory Exchange (CFX)
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IPC-2551 International Standard for Digital Twins
IPC-2551 International Standard for Digital Twins
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IPC-1782A-CN Standard for Manufacturing and Supply Chain Traceabilit...
IPC-1782A-CN Standard for Manufacturing and Supply Chain Traceability of Electronic Products (Chinese)
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IPC-A-610H Acceptability of Electronic Assemblies
IPC-A-610H Acceptability of Electronic Assemblies
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Elemental Speciation in Human Health Risk Assessment
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Elemental Speciation in Human Health Risk Assessment
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29.70
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IPC J-STD-001HA/IPC-A-610HA-CN Automotive Addendum to IPC J-STD-001H...
IPC J-STD-001HA/IPC-A-610HA-CN Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-a-610H Acceptability of Electronic Assemblies (Chinese)
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IPC J-STD-001HA/IPC-A-610HA-JP Automotive Addendum to IPC J-STD-001H...
IPC J-STD-001HA/IPC-A-610HA-JP Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-a-610H Acceptability of Electronic Assemblies (Japanese)
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IPC-A-610G-R Rail Transit Addendum to IPC-a-610G Acceptability of El...
IPC-A-610G-R Rail Transit Addendum to IPC-a-610G Acceptability of Electronic Assemblies
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2021 International Plumbing Code (IPC) Quick-Card Based on 2021 IPC
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2021 International Plumbing Code (IPC) Quick-Card Based on 2021 IPC
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IPC/WHMA-A-620C-R CN Rail Transit Addendum to IPC/WHMA-a-620C (Chine...
IPC/WHMA-A-620C-R CN Rail Transit Addendum to IPC/WHMA-a-620C (Chinese)
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IPC/WHMA-A-620C-R Rail Applications Electronic Hardware Addendum to ...
IPC/WHMA-A-620C-R Rail Applications Electronic Hardware Addendum to IPC/WHMA-a-620C
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IPC-A-610G-R-CN Rail Transit Addendum to IPC-a-610G Acceptability of...
IPC-A-610G-R-CN Rail Transit Addendum to IPC-a-610G Acceptability of Electronic Assemblies (Chinese)
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IPC-SM-817A-JP General Requirements for Dielectric Surface Mounting ...
IPC-SM-817A-JP General Requirements for Dielectric Surface Mounting Adhesives (Japanese)
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IPC a-610H-TH Acceptability of Electronic Assemblies (Thai)
IPC a-610H-TH Acceptability of Electronic Assemblies (Thai)
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IPC-D-640A Design and Critical Process Requirements for Optical Fibe...
IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
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IPC-6012EA-CN Automotive Applications Addendum to IPC-6012E Qualific...
IPC-6012EA-CN Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards (Chinese)
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IPC-4592 Requirements for Printed Electronics Functional Dielectric ...
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
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IPC J-STD-001H-TH Requirements for Soldered Electrical and Electroni...
IPC J-STD-001H-TH Requirements for Soldered Electrical and Electronic Assemblies (Thai)
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IPC-1601A-JP Printed Board Handling and Storage Guidelines (Japanese...
IPC-1601A-JP Printed Board Handling and Storage Guidelines (Japanese)
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IPC-1792 Standard for the Management and Mitigation of Cybersecurity...
IPC-1792 Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain
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IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave)...
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
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IPC-6012EA-JP Automotive Applications Addendum to IPC-6012E Qualific...
IPC-6012EA-JP Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards (Japanese)
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IPC-7093A-JP Design and Assembly Process Implementation for Bottom T...
IPC-7093A-JP Design and Assembly Process Implementation for Bottom Termination Components (BTCs) (Janpanese)
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IPC-DR-Des-2022 PCB Design Desk Reference 2022 Edition
IPC-DR-Des-2022 PCB Design Desk Reference 2022 Edition
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IPC-T-50N-CN Terms and Definitions for Interconnecting and Packaging...
IPC-T-50N-CN Terms and Definitions for Interconnecting and Packaging Electronic Circuits (Chinese)
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IPC-6012E-AM1 Qualification and Performance Specification for Rigid ...
IPC-6012E-AM1 Qualification and Performance Specification for Rigid Printed Boards Amendment 1
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IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable ...
IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
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IPC-6018D Qualification and Performance Specification for High Frequ...
IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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IPC J-STD-004C Requirements for Soldering Fluxes
IPC J-STD-004C Requirements for Soldering Fluxes
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IPC-7525C-JP Stencil Design Guidelines (Japanese)
IPC-7525C-JP Stencil Design Guidelines (Japanese)
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IPC-7801-JP Reflow Oven Process Control Standard (Japanese)
IPC-7801-JP Reflow Oven Process Control Standard (Japanese)
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IPC-7092A Design and Assembly Process Implementation for Embedded Ci...
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry
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IPC-J-STD-005B Requirements for Soldering Pastes
IPC-J-STD-005B Requirements for Soldering Pastes
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IPC-6012E-AM1-CN Qualification and Performance Specification for Rig...
IPC-6012E-AM1-CN Qualification and Performance Specification for Rigid Printed Boards (Chinese)
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IPC-4922 Requirements for Sintering Materials for Reliable Electrica...
IPC-4922 Requirements for Sintering Materials for Reliable Electrical and Thermal Interconnects
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IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
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IPC-J-STD-003D Solderability Tests for Printed Boards
IPC-J-STD-003D Solderability Tests for Printed Boards
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IPC-2591, Version 1.4 - Connected Factory Exchange (CFX)
IPC-2591, Version 1.4 - Connected Factory Exchange (CFX)
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IPC-6018DS Space and Military Avionics Applications Addendum to IPC-...
IPC-6018DS Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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IPC-7530A-JP Guidelines for Temperature Profiling for Mass Soldering...
IPC-7530A-JP Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) (Japanese)
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IPC J-STD-004C-JP Requirements for Soldering Fluxes (Japanese)
IPC J-STD-004C-JP Requirements for Soldering Fluxes (Japanese)
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IPC-9121A Troubleshooting for Printed Board Fabrication Processes
IPC-9121A Troubleshooting for Printed Board Fabrication Processes
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